2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019)

[基本信息]

会议名称:2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019)

开始日期:2019-07-05

结束日期:2019-07-07

所在国家:China

所在城市:Shanghai

主办单位: Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME)

[重要日期]

摘要截稿日期:2019-03-05

全文截稿日期:2019-03-10

[会务组联系方式]

联系电话:+852-30506862 or +86-18200296850

E-MAIL:icdepi@smehk.org

会议网站:http://www.icdepi.org/

[会议背景介绍]

Welcome to 2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2019). ICDEPI 2019 is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Shanghai, China from July 5 to 7, 2019!

The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.

[征文范围及要求]

Call for Papers 2019 3rd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from July 5-7, 2019! The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation. ●Publication Information 1. All accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other databases. 2.Selected papers with great extension will be recommended to publish in international journals. ●Topics(for more topics: http://www.icdepi.org/cfp.html ) Design Engineering Design Processes Design Theory and Research Methodology Design Organization and Management Product, Service and Systems Design Design Information and Knowledge Production Innovation Product Development and Design Product Process Design and Management Product Quality Management Intelligent Product ●Paper Submission Submission Email:icdepismehk.org Submission System: https://cmt3.research.microsoft.com/ICDEPI2019 ●Call for participants 1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us:icdepismehk.org 2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation, you are welcome to join us and share your ideas! 3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepismehk.org ●Contact Us Ms. Linda Lee Email: icdepismehk.org Tel:+852-30697937( Hong Kong) Web: http://www.icdepi.org/